NSN - 5330-01-251-0163, 5330012510163 of Packing Assembly
Aviation Axis stocks 13228E2595-88, UMP 9404 - Packing Assembly made by Cecom Lr Center, Godiva Limited Dba Godiva with 5330-01-251-0163. Owned and operated by ASAP Semiconductor, we have access to over 2 billion new and after-market parts applicable within the aerospace and defense industries. All our parts are shipped using our premier shipping and supply chain. We offer short lead-times and some of the fastest shipping times in the industry. We are well-equipped to handle any customer situation - including AOG. Submit an RFQ today and expect a response within 15 minutes or less. ASAP - the evolution of purchasing.
Alternative NSN: 5330-01-251-0163 |
Item Name: Packing Assembly |
Federal Supply Class (FSC): 5330 Packing And Gasket Materials |
NIIN: 012510163 |
NCB Code: USA (01) |
Manufacturers: Cecom Lr Center, Godiva Limited Dba Godiva |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
13228E2595-88 | cecom lr center | packing assembly | Avl | RFQ |
UMP 9404 | godiva limited dba godiva | packing assembly | Avl | RFQ |
Technical Characteristics of NSN 5330012510163
MRC | Criteria | Characteristic |
---|---|---|
FEAT | SPECIAL FEATURES | UTILIZED ON TRUCK,FIREFIGHTING,1000 GPM,TM5-4210-220-20P |
Related NSN List for 5330-01-251-0163, 5330012510163
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