NSN - 5961-00-239-9614, 5961002399614 of Semiconductor Devic
Aviation Axis stocks 479-0726-010, CD34166, G3778 - Semiconductor Devic made by Boeing Company The, Telcom Semiconductor Inc, N A P Smd Technology Inc with 5961-00-239-9614. Owned and operated by ASAP Semiconductor, we have access to over 2 billion new and after-market parts applicable within the aerospace and defense industries. All our parts are shipped using our premier shipping and supply chain. We offer short lead-times and some of the fastest shipping times in the industry. We are well-equipped to handle any customer situation - including AOG. Submit an RFQ today and expect a response within 15 minutes or less. ASAP - the evolution of purchasing.
| Alternative NSN: 5961-00-239-9614 |
| Item Name: Semiconductor Devic |
| Federal Supply Class (FSC): 5961 Semiconductor Devices And Associated Hardware |
| NIIN: 002399614 |
| NCB Code: USA (00) |
| Manufacturers: Boeing Company The, N A P Smd Technology Inc, Telcom Semiconductor Inc |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 479-0726-010 | boeing company the | semiconductor devic | Avl | RFQ |
| CD34166 | telcom semiconductor inc | semiconductor devic | Avl | RFQ |
| G3778 | n a p smd technology inc | semiconductor devic | Avl | RFQ |
Technical Characteristics of NSN 5961002399614
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.300 INCHES NOMINAL |
| ADAV | OVERALL DIAMETER | 0.021 INCHES NOMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
Related NSN List for 5961-00-239-9614, 5961002399614
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