NSN - 5962-01-120-1265, 5962011201265 of Microcircuit Digital
Aviation Axis stocks 14025BBCAJC, 1820-1965, 351-8159-150, 355180, 4025BDMQB - Microcircuit Digital made by Freescale Semiconductor, Hewlett Packard Co, Agilent Technologies, Rockwell Collins Inc, Fluke Electronics Corp with 5962-01-120-1265. Owned and operated by ASAP Semiconductor, we have access to over 2 billion new and after-market parts applicable within the aerospace and defense industries. All our parts are shipped using our premier shipping and supply chain. We offer short lead-times and some of the fastest shipping times in the industry. We are well-equipped to handle any customer situation - including AOG. Submit an RFQ today and expect a response within 15 minutes or less. ASAP - the evolution of purchasing.
| Alternative NSN: 5962-01-120-1265 |
| Item Name: Microcircuit Digital |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011201265 |
| NCB Code: USA (01) |
| Manufacturers: Adelco Elektronik Gmbh, Agilent Technologies, Allegro Microsystems Inc, Eldec Corporation, Fairchild Semiconductor Corp, Fluke Electronics Corp, Freescale Semiconductor, General Dynamics Land Systems, General Dynamics Ots Inc, Harris Llc, Hewlett Packard Co, Honeywell Aerospace, Intersil Corporation, Lacon Electronic Gmbh, National Semiconductor Corp, Rca Corp, Rca Corp Picture Tube Div, Rockwell Collins Inc, Rycom Instruments, Saab Ab Publ Business Area Surveillance Ew Systems Jarfalla, Saab Dynamics Ab, Selex Communications Inc |
Technical Characteristics of NSN 5962011201265
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.160 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | F16MAINTNTRNG 81755 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND LOW POWER AND W/BUFFERED OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | TRIPLE 3 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 3 GATE, NOR |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 18.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 320.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 320.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 16340-60-00010 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
Related NSN List for 5962-01-120-1265, 5962011201265
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