NSN - 5962-01-320-4173, 5962013204173 of Microcircuit Memory
Aviation Axis stocks 5962-86875, 5962-8687502ZA, 5962-8687506BZA, 5962-8687506BZB, 5962-8687506BZX - Microcircuit Memory made by Dla Land And Maritime, Integrated Device Technology Inc with 5962-01-320-4173. Owned and operated by ASAP Semiconductor, we have access to over 2 billion new and after-market parts applicable within the aerospace and defense industries. All our parts are shipped using our premier shipping and supply chain. We offer short lead-times and some of the fastest shipping times in the industry. We are well-equipped to handle any customer situation - including AOG. Submit an RFQ today and expect a response within 15 minutes or less. ASAP - the evolution of purchasing.
Alternative NSN: 5962-01-320-4173 |
Item Name: Microcircuit Memory |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013204173 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime, Integrated Device Technology Inc |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
5962-86875 | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8687502ZA | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8687506BZA | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8687506BZB | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8687506BZX | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8687506ZA | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8687506ZB | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8687506ZX | dla land and maritime | microcircuit memory | Avl | RFQ |
IDT7130LA-70L52B | integrated device technology inc | microcircuit memory | Avl | RFQ |
IDT7130LA-70L52S | integrated device technology inc | microcircuit memory | Avl | RFQ |
Technical Characteristics of NSN 5962013204173
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.739 INCHES MINIMUM AND 0.761 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.739 INCHES MINIMUM AND 0.761 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND W/ENABLE |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQZP | INPUT CIRCUIT PATTERN | 44 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 52 LEADLESS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-6 MIL-M-38510 |
ADAU | BODY HEIGHT | 0.082 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZER | MEMORY DEVICE TYPE | RAM |
Related NSN List for 5962-01-320-4173, 5962013204173
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