NSN - 5962-01-264-3011, 5962012643011 of Microcircuit Memory

Aviation Axis stocks 794952-1, 794952-1-0013, 81036, 81036112A, 81036112B - Microcircuit Memory made by Hamilton Sundstrand Corporation, Dla Land And Maritime, Advanced Micro Devices Inc, Texas Instruments Inc, Mmi Amd with 5962-01-264-3011. Owned and operated by ASAP Semiconductor, we have access to over 2 billion new and after-market parts applicable within the aerospace and defense industries. All our parts are shipped using our premier shipping and supply chain. We offer short lead-times and some of the fastest shipping times in the industry. We are well-equipped to handle any customer situation - including AOG. Submit an RFQ today and expect a response within 15 minutes or less. ASAP - the evolution of purchasing.

Alternative NSN: 5962-01-264-3011
Item Name: Microcircuit Memory
Federal Supply Class (FSC): 5962 Microcircuits Electronic
NIIN: 012643011
NCB Code: USA (01)
Manufacturers: Advanced Micro Devices Inc, Dla Land And Maritime, Hamilton Sundstrand Corporation, Mmi Amd, Texas Instruments Inc
Part No Manufacturer Item Name QTY RFQ
794952-1 hamilton sundstrand corporation microcircuit memory Avl RFQ
794952-1-0013 hamilton sundstrand corporation microcircuit memory Avl RFQ
81036 dla land and maritime microcircuit memory Avl RFQ
81036112A dla land and maritime microcircuit memory Avl RFQ
81036112B dla land and maritime microcircuit memory Avl RFQ
81036112X dla land and maritime microcircuit memory Avl RFQ
AMPAL16L8L B2A advanced micro devices inc microcircuit memory Avl RFQ
PAL16L8A-2MFKB texas instruments inc microcircuit memory Avl RFQ
PAL16L8A 2ML 883B mmi amd microcircuit memory Avl RFQ
PROM ROM HEAD 213 dla land and maritime microcircuit memory Avl RFQ

Technical Characteristics of NSN 5962012643011

MRCCriteriaCharacteristic
ADAQBODY LENGTH0.358 INCHES MAXIMUM
ADATBODY WIDTH0.358 INCHES MAXIMUM
ADAUBODY HEIGHT0.100 INCHES MAXIMUM
AEHXMAXIMUM POWER DISSIPATION RATING500.0 MILLIWATTS
AFGAOPERATING TEMP RANGE-55.0/+125.0 DEG CELSIUS
AFJQSTORAGE TEMP RANGE-65.0/+150.0 DEG CELSIUS
CBBLFEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS
CQSJINCLOSURE MATERIALCERAMIC AND GLASS
CQSZINCLOSURE CONFIGURATIONLEADLESS FLAT PACK
CQWXOUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
CQZPINPUT CIRCUIT PATTERN16 INPUT
CTFTCASE OUTLINE SOURCE AND DESIGNATORC-2 MIL-M-38510
CTQXCURRENT RATING PER CHARACTERISTIC100.00 MILLIAMPERES FORWARD CURRENT, MAXIMUM PEAK TOTAL VALUE NOT APPLICABLE
CWSGTERMINAL SURFACE TREATMENTSOLDER
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
CZEQTIME RATING PER CHACTERISTIC50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
CZERMEMORY DEVICE TYPEPAL
TESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TTQYTERMINAL TYPE AND QUANTITY20 LEADLESS

Related NSN List for 5962-01-264-3011, 5962012643011

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