NSN - 5962-01-285-3500, 5962012853500 of Microcircuit Memory

Aviation Axis stocks 807668-8, 82005, 8200504ZA, 8200504ZB, 8200504ZX - Microcircuit Memory made by Raytheon Company, Dla Land And Maritime, Advanced Micro Devices Inc, Intel Corp with 5962-01-285-3500. Owned and operated by ASAP Semiconductor, we have access to over 2 billion new and after-market parts applicable within the aerospace and defense industries. All our parts are shipped using our premier shipping and supply chain. We offer short lead-times and some of the fastest shipping times in the industry. We are well-equipped to handle any customer situation - including AOG. Submit an RFQ today and expect a response within 15 minutes or less. ASAP - the evolution of purchasing.

Alternative NSN: 5962-01-285-3500
Item Name: Microcircuit Memory
Federal Supply Class (FSC): 5962 Microcircuits Electronic
NIIN: 012853500
NCB Code: USA (01)
Manufacturers: Advanced Micro Devices Inc, Dla Land And Maritime, Intel Corp, Raytheon Company
Part No Manufacturer Item Name QTY RFQ
807668-8 raytheon company microcircuit memory Avl RFQ
82005 dla land and maritime microcircuit memory Avl RFQ
8200504ZA dla land and maritime microcircuit memory Avl RFQ
8200504ZB dla land and maritime microcircuit memory Avl RFQ
8200504ZX dla land and maritime microcircuit memory Avl RFQ
AM2764A-25 BUA advanced micro devices inc microcircuit memory Avl RFQ
MR2764A-25 B intel corp microcircuit memory Avl RFQ
ROM PROM HEAD 155 dla land and maritime microcircuit memory Avl RFQ

Technical Characteristics of NSN 5962012853500

MRCCriteriaCharacteristic
ADAQBODY LENGTH0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
ADATBODY WIDTH0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
ADAUBODY HEIGHT0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
AEHXMAXIMUM POWER DISSIPATION RATING1.0 WATTS
AFGAOPERATING TEMP RANGE-55.0 TO 125.0 DEG CELSIUS
AFJQSTORAGE TEMP RANGE-65.0 TO 150.0 DEG CELSIUS
CBBLFEATURES PROVIDEDHERMETICALLY SEALED AND PROGRAMMABLE AND BURN IN AND ULTRAVIOLET ERASABLE AND W/ENABLE
CQSJINCLOSURE MATERIALCERAMIC
CQSZINCLOSURE CONFIGURATIONLEADLESS FLAT PACK
CQWXOUTPUT LOGIC FORMN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
CQZPINPUT CIRCUIT PATTERN16 INPUT
CTFTCASE OUTLINE SOURCE AND DESIGNATORC-12 MIL-M-38510
CTQXCURRENT RATING PER CHARACTERISTIC100.00 MILLIAMPERES MAXIMUM SUPPLY
CWSGTERMINAL SURFACE TREATMENTSOLDER
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
CZEQTIME RATING PER CHACTERISTIC250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
CZERMEMORY DEVICE TYPEPROM
TESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TTQYTERMINAL TYPE AND QUANTITY32 LEADLESS

Related NSN List for 5962-01-285-3500, 5962012853500

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